TDK announces T5818: industry’s widest dynamic range PDM microphone

  ● T5818 is a 66dB SNR/135dB AOP digital microphone

  ● High Quality Mode at 590 µA, Low Power Mode at 215 µA

  ● Industry standard 3.5 x 2.65 x 0.98mm package

  ● Market Leading RF Performance

  TDK Corporation (TSE: 6762) announces the T5818 Pulse Density Modulation (PDM) microphone with a dynamic range of 107dB at 590µA, the widest dynamic range in the industry at the lowest power. This allows for excellent acoustic performance in environments that shift from very quiet to very loud, such as far field voice pickup barge-in for Smart Speaker applications.

  The T5818 microphone features 66dBA SNR, 135dB SPL AOP, at 590 µA in High Quality Mode (HQM), and decreases power consumption to 215 µA in Low Power Mode (LPM). This microphone is essential for capturing high quality audio inputs, which plays a vital role for AI engines and cloud-based applications that require a PDM microphone interface. Current analog output wide dynamic range microphones require expensive ADCs to take advantage of full acoustic capabilities. The T5818 provides this ADC conversion while maintaining excellent dynamic range with the benefits of a PDM low latency bit stream. This makes the T5818 suitable for a wide range of applications, from mobile phones to ANC headsets.

  “We are very excited about the advances in PDM performance included in the T5818,” said Hiro Hayashi, Vice President, Audio, InvenSense, a TDK Group Company. “This microphone compliments our market leading analog portfolio, solidifying TDK’s performance leadership in MEMS microphone technolgy.”

  TDK will be demonstrating the T5818 microphone along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries in its booth #11448 at CES, Central Hall (LVCC), Las Vegas Convention Center, January 7-10, 2020 in Las Vegas, Nevada. T5818is currently in mass production and will be available through distribution in Q1 2020.


  ● HQM: High Quality Mode

  ● LPM: Low Power Mode

  ● AOP: Acoustic Overload Point

  Main applications

  ● Smartphones

  ● Microphone Arrays

  ● Tablets

  ● Cameras

  ● Bluetooth Headsets

  ● Notebook PCs

  ● Security and Surveillance

  Key features

  ● 5 × 2.65 × 0.98 mm surface‐mount package

  ● Low power: 215 µA in Low‐Power Mode

  ● Extended frequency response from 40 Hz to >20 kHz

  ● Sleep Mode: 8 µA

  ● High power supply rejection (PSR): −98 dB FS

  ● Fourth‐order Σ‐Δ modulator

  ● Digital pulse density modulation (PDM) output

  ● Compatible with Sn/Pb and Pb‐free solder processes

  ● RoHS/WEEE compliant

  Key data


  Packaging Dimensions (mm):3.50 × 2.65 × 0.98

  SNR dBA:66

  Acoutsic Overload Point dB SPL:135

  Low Power Mode µA:215

  Bandwidth kHz:20

  Low Frequency Corner H:z40

  Digital Interface:PDM

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